MPC561MZP56 Freescale, MPC561MZP56 Datasheet - Page 310

MPC561MZP56

Manufacturer Part Number
MPC561MZP56
Description
Manufacturer
Freescale
Datasheet

Specifications of MPC561MZP56

Cpu Family
MPC56x
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
56MHz
Interface Type
QSPI/SCI/SPI/UART
Total Internal Ram Size
32KB
# I/os (max)
56
Number Of Timers - General Purpose
22
Operating Supply Voltage (typ)
2.6/5V
Operating Supply Voltage (max)
2.7/5.25V
Operating Supply Voltage (min)
2.5/4.75V
On-chip Adc
2(32-chx10-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
388
Package Type
BGA
Program Memory Type
ROMLess
Program Memory Size
Not Required
Lead Free Status / RoHS Status
Not Compliant

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Clocks and Power Control
Note that GCLK1_50, GCLK2_50, and CLKOUT can have a lower frequency than GCLK1 and GCLK2.
This is to enable the external bus operation at lower frequencies (controlled by EBDF in the SCCR).
GCLK2_50 always rises simultaneously with GCLK2. When DFNH = 0, GCLK2_50 has a 50% duty
cycle. With other values of DFNH or DFNL, the duty cycle is less than 50%. Refer to
GCLK1_50 rises simultaneously with GCLK1. When the MPC561/MPC563 is not in gear mode, the
falling edge of GCLK1_50 occurs in the middle of the high phase of GCLK2_50. EBDF determines the
division factor between GCLK1/GCLK2 and GCLK1_50/GCLK2_50.
During power-on reset, the MODCK1, MODCK2, and MODCK3 pins determine the clock source for the
PLL and the clock drivers. These pins are latched on the positive edge of PORESET. Their values must be
stable as long as this line is asserted. The configuration modes are shown in
8-8
GCLK1
GCLK2
CLKOUT
(EBDF = 00)
GCLK1_50
(EBDF = 01)
GCLK2_50
(EBDF = 01)
CLKOUT
(EBDF = 01)
T1
T2
T3
T4
GCLK1_50
(EBDF = 00)
GCLK2_50
(EBDF = 00)
MPC561/MPC563 Reference Manual, Rev. 1.2
Figure 8-4. MPC561/MPC563 Clocks
Table
8-1. MODCK1 specifies
Freescale Semiconductor
Figure
8-7.

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