MPC561MZP56 Freescale, MPC561MZP56 Datasheet - Page 41
MPC561MZP56
Manufacturer Part Number
MPC561MZP56
Description
Manufacturer
Freescale
Datasheet
1.MPC561MZP56.pdf
(1420 pages)
Specifications of MPC561MZP56
Cpu Family
MPC56x
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
56MHz
Interface Type
QSPI/SCI/SPI/UART
Total Internal Ram Size
32KB
# I/os (max)
56
Number Of Timers - General Purpose
22
Operating Supply Voltage (typ)
2.6/5V
Operating Supply Voltage (max)
2.7/5.25V
Operating Supply Voltage (min)
2.5/4.75V
On-chip Adc
2(32-chx10-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
388
Package Type
BGA
Program Memory Type
ROMLess
Program Memory Size
Not Required
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC561MZP56
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC561MZP56R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
- Current page: 41 of 1420
- Download datasheet (11Mb)
Figure
Number
1-1
1-2
1-3
1-4
2-1
2-2
2-3
2-4
2-5
2-6
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
3-9
3-10
3-11
3-12
3-13
3-14
3-15
3-16
3-17
3-18
3-19
4-1
4-2
4-3
4-4
4-5
4-6
4-7
4-8
4-9
4-10
Freescale Semiconductor
MPC561/MPC563 Block Diagram ........................................................................................... 1-3
Recommended Connection Diagram for IRAMSTBY........................................................... 1-11
MPC561/MPC563 Memory Map ........................................................................................... 1-12
MPC561/MPC563 Internal Memory Map .............................................................................. 1-14
MPC561/MPC563 Signal Groupings ....................................................................................... 2-2
Pads Module Configuration Register (PDMCR) .................................................................... 2-22
Pads Module Configuration Register 2 (PDMCR2) ............................................................... 2-23
Debug Mode Selection (JTAG) .............................................................................................. 2-30
Debug Mode Selection (BDM)............................................................................................... 2-30
Debug Mode Selection (Nexus).............................................................................................. 2-31
RCPU Block Diagram .............................................................................................................. 3-2
Sequencer Data Path ................................................................................................................. 3-4
RCPU Programming Model ..................................................................................................... 3-8
General-Purpose Registers (GPRs)......................................................................................... 3-12
Floating-Point Registers (FPRs) ............................................................................................. 3-13
Floating-Point Status and Control Register (FPSCR)............................................................. 3-14
Condition Register (CR) ......................................................................................................... 3-16
Integer Exception Register (XER) .......................................................................................... 3-18
Link Register (LR).................................................................................................................. 3-19
Count Register (CTR) ............................................................................................................. 3-19
Machine State Register (MSR) ............................................................................................... 3-20
DAE/Source Instruction Service Register (DSISR) ............................................................... 3-22
Data Address Register (DAR) ................................................................................................ 3-23
Machine Status Save/Restore Register 0 (SRR0) ................................................................... 3-23
Machine Status Save/Restore Register 1 (SRR1) ................................................................... 3-24
SPRG0–SPRG3 — General Special-Purpose Registers 0–3 .................................................. 3-24
Processor Version Register (PVR) ......................................................................................... 3-25
Floating-Point Exception Cause Register (FPECR) ............................................................... 3-26
Basic Instruction Pipeline ....................................................................................................... 3-38
BBC Module Block Diagram ................................................................................................... 4-2
Exception Table Entries Mapping ............................................................................................ 4-8
External Interrupt Vectors Splitting........................................................................................ 4-12
DECRAM Interfaces Block Diagram ..................................................................................... 4-13
BTB Block Diagram ............................................................................................................... 4-16
MPC561/MPC563 Memory Map ........................................................................................... 4-17
BBC Module Configuration Register (BBCMCR)................................................................. 4-19
Region Base Address Register (MI_RBA[0:3]) ..................................................................... 4-21
Region Attribute Register (MI_RA0[0:3]) ............................................................................. 4-22
Global Region Attribute Register (MI_GRA) ........................................................................ 4-23
MPC561/MPC563 Reference Manual, Rev. 1.2
Figures
Title
Number
Page
xli
Related parts for MPC561MZP56
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
MPC5 1K0 5%
Manufacturer:
TE Connectivity
Datasheet:
Part Number:
Description:
MPC5 500R 5%
Manufacturer:
TE Connectivity
Datasheet:
Part Number:
Description:
MPC5 5K0 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC5 5R0 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC5 50K 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC5 1R0 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
TOWER ELEVATOR BOARDS HARDWARE
Manufacturer:
Freescale Semiconductor
Datasheet:
Part Number:
Description:
TOWER SERIAL I/O HARDWARE
Manufacturer:
Freescale Semiconductor
Datasheet:
Part Number:
Description:
LCD MODULE FOR TWR SYSTEM
Manufacturer:
Freescale Semiconductor
Datasheet:
Part Number:
Description:
DAUGHTER LCD WVGA I.MX51
Manufacturer:
Freescale Semiconductor
Datasheet:
Part Number:
Description:
TOWER SYSTEM BOARD MPC5125
Manufacturer:
Freescale Semiconductor
Datasheet: