MPC561MZP56 Freescale, MPC561MZP56 Datasheet - Page 1309
MPC561MZP56
Manufacturer Part Number
MPC561MZP56
Description
Manufacturer
Freescale
Datasheet
1.MPC561MZP56.pdf
(1420 pages)
Specifications of MPC561MZP56
Cpu Family
MPC56x
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
56MHz
Interface Type
QSPI/SCI/SPI/UART
Total Internal Ram Size
32KB
# I/os (max)
56
Number Of Timers - General Purpose
22
Operating Supply Voltage (typ)
2.6/5V
Operating Supply Voltage (max)
2.7/5.25V
Operating Supply Voltage (min)
2.5/4.75V
On-chip Adc
2(32-chx10-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
388
Package Type
BGA
Program Memory Type
ROMLess
Program Memory Size
Not Required
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC561MZP56
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC561MZP56R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
G.2
The MPC561/MPC563 is available in packaged form. The package is a 388-ball PBGA having a 1.0 mm
ball pitch, Freescale case outline 1164-01 (See
G.3
G.3.1
The document referenced for the EMC testing of MPC561/MPC563 is SAE J1752/3 Issued 1995-03
G.3.2
EMC – Electromagnetic Compatibility
EMI – Electromagnetic Interference
TEM cell – Transverse Electromagnetic Mode cell
G.3.3
G.4
Freescale Semiconductor
1. Scan range: 150 KHz – 1000 MHz
2. Operating Frequency: 66 MHz
3. Operating Voltages: 2.6 V, 5.0 V
4. Max spikes: TBD dBuV
5. I/O port waveforms: Per J1752/3
6. Temperature: 25 °C
BGA Package Thermal Resistance,
Junction to Ambient – Natural Convection
BGA Package Thermal Resistance,
Junction to Ambient – Four layer (2s2p) board, natural
convection
Package
EMI Characteristics
Thermal Characteristics
Reference Documents
Definitions and Acronyms
EMI Testing Specifications
Negative current flows out of the pin and positive current flows into the pin.
Characteristic
MPC561/MPC563 Reference Manual, Rev. 1.2
Table G-2. Thermal Characteristics
Figure G-63
NOTE
Symbol
R
R
θJMA
and
θJA
Figure
SS
or V
G-64).
47.3
29.4
DD
Value
).
1,2,3
3,4
,
5
66-MHz Electrical Characteristics
°C/W
°C/W
Unit
G-3
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