MPC561MZP56 Freescale, MPC561MZP56 Datasheet - Page 1319

MPC561MZP56

Manufacturer Part Number
MPC561MZP56
Description
Manufacturer
Freescale
Datasheet

Specifications of MPC561MZP56

Cpu Family
MPC56x
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
56MHz
Interface Type
QSPI/SCI/SPI/UART
Total Internal Ram Size
32KB
# I/os (max)
56
Number Of Timers - General Purpose
22
Operating Supply Voltage (typ)
2.6/5V
Operating Supply Voltage (max)
2.7/5.25V
Operating Supply Voltage (min)
2.5/4.75V
On-chip Adc
2(32-chx10-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
388
Package Type
BGA
Program Memory Type
ROMLess
Program Memory Size
Not Required
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC561MZP56
Manufacturer:
FREESCALE
Quantity:
852
Part Number:
MPC561MZP56
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC561MZP56
Manufacturer:
FREESCALE
Quantity:
852
Company:
Part Number:
MPC561MZP56
Quantity:
13
Part Number:
MPC561MZP56R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
There are two power-up/down options. Choosing which one is required for an application will depend
upon circuitry connected to 2.6-V compliant pins and dual 2.6-V/5-V compliant pins. Power-up/down
option A is required if 2.6-V compliant pins and dual 2.6-V/5-V compliant pins are connected to the 5-V
supply with a pull-up resistor or driven by 5-V logic during power-up/down. In applications for which this
scenario is not true the power-up/down option B may be implemented. Option B is less stringent and easier
to ensure over a variety of applications.
Refer to
The power consumption during power-up/down sequencing will stay below the operating power
consumption specifications when following these guidelines.
G.9.1
The Option A power-up sequence (excluding V
The first step in the sequence is required is due to gate-to-drain stress limits for transistors in the pads of
2.6-V compliant pins and dual 2.6-V/5-V compliant pins. Damage can occur if gate-to-drain voltage
potential is greater than 3.1 V. This is only a concern at power-up/down. The second step in the sequence
is required is due to ESD diodes in the pad logic for dual 2.6-V/5-V compliant pins and 2.6-V pins. The
diodes are forward biased when V
Figure G-1
power-up sequence if a keep-alive supply is required. The keep-alive supply should be powered-up at the
same instant or before both the high voltage and low voltage supplies are powered-up.
Freescale Semiconductor
1. V
2. V
Table 2-1
DDH
DDH
illustrates the power-up sequence if no keep-alive supply is required.
Power-Up/Down Option A
The V
rate less that 25V/ms.
V
V
DDL
DDL
Figure G-1. Option A Power-Up Sequence Without Keep-Alive Supply
for a list of 2.6 V and dual 2.6V/5 V compliant pins.
DDH
+ 3.1 V (V
- 0.5 V (V
V
V
DDH
DDH
ramp voltage should be kept below 50V/ms and the V
cannot lead V
cannot lag V
DDH
MPC561/MPC563 Reference Manual, Rev. 1.2
DDH
DDL
cannot lag V
cannot lead V
DDL
is greater than V
DDL
by more than 0.5 V
by more than 3.1 V
3.1-V lead
DDKA
DDL
DDL
NOTE:
0.5-V lag
) is
by more than 0.5 V)
DDH
by more than 3.1 V)
and will start to conduct current.
66-MHz Electrical Characteristics
DDL
Figure G-2
V
V
DDH
DDL
ramp
illustrates the
G-13

Related parts for MPC561MZP56